Our founders are physicist who can design systems and have life-long experience in developing sputtering and PECVD equipment. Our philosophy is to push every aspects of our solution to either perfection or the limit of nature, so our manufacturing equipment won't be obsolete once implemented in large scale.
It look us 25 years to have the first system and deposition source idea that achieves the perfection for all aspects of a sputtering equipment for wafers, it took another 5 years to test and optimize each module and extend it to PECVD and also on large panels and web. Our patents cover how we do it.
Our plasma sources are continuous loops or infinite in size to a substrate, so it is intrinsic uniform in all film properties, without edge effects seen in other deposition sources. We confine the plasmas so that no energetic electrons damage the substrate, and can lower the ion energy by 90% to reduce ion damages. Our process window is 0.1mT to 20 Torr, much wider than other plasma system. Our process is extremely stable due to the static source and total plasma confinement, so little hysteresis in reactive sputtering, and no gas phase reaction in PECVD!
After initial capital spending on building a factory, the operation cost is the competitive edge. Our material utilization for planar sputtering targets is same as much more expensive and lower quality rotary targets. Our PECVD simply use 100% of the active gas, and even save the waste treatment system. Our target material loading and shield arrangement enable 10x longer operation time between PM for both PVD and PECVD, saving lots of labor, parts, and downtime. Our massive parallel processing reduce heat loss, energy usage and depreciation cost
We work with customers to know their needs, provide the industrial experience for both the conventional ways and maybe a better way to build a production lines, based on our IP and new ideas. We do preliminary design and test out key concept. We want our solution to be the best one for the application, reducing or eliminating the risk of factories becoming obsolete. Our lower overhead and simpler designs typically lower the capital spending and we can take customer equity as part of payment.
We achieved so many technology breakthroughs by concentrating knowledge and experience in a small team, so that we can carry out virtual iterations, self-criticizing and thoughts experiments until we come up with the best ideas. The same quality apply to manufacturing our equipment: we do the design, documentation, assembly and test and subcontract the rest to the best in our industry. We learned from construction industry: we are the architect and general contractor, with IP and an application lab. We are also open to work with customers' choice of equipment partners to manufacture and service our solutions.
The pictures in this web site are from our past sales of equipment. Contact us for our new "Best Against Nature (TM)" solutions.
Ideal for production:
Continuous processing, high throughput, high material utilization, and low cost relative to through put
Ideal for low capital cost production
Batch, low cost, high material utilization, good for long processes and thick films
Ideal for R&D and small scale production
Small foot print, simple, low cost, in-line system .
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